FR4 HDI PCB ENIG Multilayers HDI Circuit Board

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Buried hole: Buried hole, the connection of any circuit layer inside the PCB but not conducted to the outer layer. This process cannot be achieved by drilling after bonding. Drilling must be performed on individual circuit layers. First, the inner layer must be partially bonded and then electroplated. Finally, all bonding can be performed. Compared with the original "through hole" and "Blind hole" is more labor-intensive, so the price is also the most expensive. This process is usually only used on high-density (HDI PCB) boards to increase the available space for other circuit layers. Via is an important factor in multi-layer PCB design. A via is mainly composed of three parts, one is the hole; the other is the pad area around the hole; the third is the POWER layer isolation area. The process of the via hole is to coat a layer of metal on the cylindrical surface of the hole wall of the via hole by chemical deposition to connect the copper foils that need to be connected in th…

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