High Strength Brass Coated Steel Core Wire 

This new technology originates from silicon cutting (wafers), the main material in photovoltaics and semiconductor applications. In the 1980s, people took advantage of this emerging technology to reduce product notch material loss and improve product production efficiency. In the early 1990s, this technology was used in the electronics industry to cut silicon ingots into wafers, replacing the traditional cutting methods of saw blades and grinding wheels. Second to laser cutting, better than traditional cutting. Therefore, wire saw cutting is widely used and is mostly used for cutting other hard and brittle materials with high precision. To achieve the purpose of high efficiency, high productivity and high precision. Core wire for Diamond wire (resin bonded diamond wire and electroplated diamond Wire) produced by the high quality raw material with optimized heat treatment and wire drawing process, which showed ultra tensile strength,accurate controlled diameter and good s…