Precision Diamond Wire for Silicon Cutting 

Precision Diamond Wire for Silicon Cutting For the slice processing method used for electronic materials, we expedite transition from a conventional free abrasive grain method to a fixed abrasive grain method. The fixed abrasive grain method enables higher production capacity and eases environmental strain for a revolutionary improvement in slice processing of electronic materials.Our high-speed, high-strength diamond fixation technology enables us to produce our diamond saw cutting wire with high-efficiency at a low cost. Parameters： NO. Size Core Wire（mm） Emery Granularity（μm） Diamete range（mm） Broken Puling Force（N） 1 0.35 0.25 40-50 0.330-0.360 ≧160…